flip chip ic package

High-Performance Microelectronics to Enable Next-Generation Systems

Custom high-performance microelectronics development and test services. Customizable product blocks.
Tektronix Component Solutions - delivering the performance behind Tektronix test and measurement equipment to your next-generation systems.

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SERVICES & PRODUCTS

ic packaging

IC Packaging

Turnkey custom high-performance IC package development, including design, lean manufacturing, test and supply chain mgmt.

electronic component testing

Electronic Component Testing

Complete commercial-off-the-shelf (COTS) component sourcing, testing and management services for military, space and commercial aerospace applications.

asic design services

ASIC Design Services

High-performance analog and mixed-signal ASIC design services, with emphasis on signal acquisition, conditioning, generation and conversion.

rf & microwave

RF & Microwave

Turnkey custom high-performance RF and microwave module and integrated microwave assembly (IMA) development, including design, lean manufacturing and test.

high speed data converters

High Speed Data Converters

World's fastest commercially available 8-bit analog-to-digital and 10-bit digitial-to-analog converter modules and custom data converter module development.

rf2d solutions

RF2D™ Solutions

Combining RF/microwave and high-speed data converter expertise to deliver wideband signal capture and generation solutions that effectively manage C-SWaP considerations.


Featured Items

Case Study

View our latest case study, discussing the qualification and development process for our
40 GHz leadless chip carrier IC package plaform.

25 GS/s 10-bit DAC

Read our latest news, announcing the TDAC-25 Digital-to-Analog Converter, a 25 GS/s DAC ideal for wideband commercial and defense applications.

Microwave Journal Blog

We took over the "Tek Talk" blog on MWJ to provide advice on RF/Microwave development. Click to read our first post, tips on RF assembly techniques.

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