flip chip ic package

High-Performance Microelectronics to Enable Next-Generation Systems

Custom high-performance microelectronics development and test services. Customizable product blocks.
Tektronix Component Solutions - delivering the performance behind Tektronix test and measurement equipment to your next-generation systems.



ic packaging

IC Packaging

Turnkey custom high-performance IC package development, including design, lean manufacturing, test and supply chain mgmt.

electronic component testing

Electronic Component Testing

Complete commercial-off-the-shelf (COTS) component sourcing, testing and management services for military, space and commercial aerospace applications.

rf & microwave

RF & Microwave

Turnkey custom high-performance RF and microwave module and integrated microwave assembly (IMA) development, including design, lean manufacturing and test.

Featured Items

Case Study

View our latest case study, discussing the qualification and development process for our
40 GHz leadless chip carrier IC package plaform.

Microwave Journal Blog

We took over the "Tek Talk" blog on MWJ to provide advice on RF/Microwave development. Click to read our first post, tips on RF assembly techniques.