Communications
ADVANCED MICROELECTRONICS ENABLing ADVANCED HIGH-SPEED COMM. SYSTEMS
The overwhelming popularity of smart phones, and their insatiable demand for bandwidth to support streaming video and applications, has network operators looking to equipment suppliers for high-speed solutions to expand the capacity of their networks. Accomplishing that goal requires high-performance microelectronics to enable the advanced capabilities of next generation systems, and a development partner who is a leader in the field.
Tektronix Component Solutions is an expert at high-performance microelectronic development and has proven capabilities serving high-speed communications applications – including 40G and 100G commercial applications as well as military applications. Our broad base of capabilities is well-suited for the requirements of communication system manufacturers. With experience and capabilities that span advanced electro-optical modules, customizable high-frequency Ball Grid Array (BGA) and Leadless Chip Carrier (LCC) IC packaging platforms, high-speed data converters and wideband ASIC design services, Tektronix Component Solutions is the microelectronics partner you can trust to enable your next generation communications systems.
Electro-Optical Modules
We provide turnkey capabilities for electro-optical modules – including design, assembly and test services. Previous experience includes development of a proprietary prism that bends the optical path to enable a lower product profile for an optical transceiver device. For that same product, Tektronix Component Solutions used a custom six axis alignment system for active alignment of the optics and developed an electro-optical test suite capable of testing up to four receiver channels simultaneously.
Adding to our expertise in electro-optical module development, we have advanced capabilities in optical interconnect technologies. Our capabilities include, but are not limited to:
- Fiber tip polishing and lensing
- Active optical alignment for multi-mode fiber products
- Single or multi-channel devices
- Fiber positioning and attachment
- Hermetic fiber sealing
- Micro-optic lens design
- Opto-mechanical package design
- VCSEL characterization for temperature stability
- Parallel Bit Error Rate Testing (BERT)
- Custom optical test fixture design and test station development
- Optical component selection
High-Performance IC Packaging
Tektronix Component Solutions’ high-performance packaging capabilities enable the development of next-generation communications systems. Our customizable 15 and 30+ GHz BGA and 40+ GHz LCC package platforms, qualified specifically with the needs of communications customers in mind, shorten the development cycle for high-performance ASIC packages, improving time-to-market for high-speed communications product deployment.
We also have advanced capabilities in a variety of other IC packaging and interconnect technologies.
Data Converter Modules
Our high-speed data converter modules, leveraging proprietary Tektronix analog-to-digital (ADC) and digital-to-analog (DAC) converter technology, support the high-speed requirements of communications customers. Our reference modules, detailed below, provide exceptional performance over an unprecedented analog bandwidth for application prototype development or deployment in embedded systems.
- 8 bits
- 6.25 GHz Bandwidth
- 12.5 GS/s (100 Gbps)
- 10 bits
- 9 GHz Bandwidth
- 12 GS/s (120 Gbps)
We also offer custom data converter development services, including a previous development project that delivered a 50 GS/s data converter for a 100G application.
ASIC Design Services
As the provider of the advanced components found inside Tektronix instrumentation, Tektronix Component Solutions has unique expertise in high-performance ASIC development. From wideband amplifiers to advanced ADCs and DACs, our ASIC design services enable development of high-speed communications systems. To meet your needs for a custom IC, Tektronix Component Solutions can design the ASIC, manage the foundry and fabrication process, and complete the assembly and test of the part.
RF & Microwave Modules
Tektronix Component Solutions offers turnkey development services for custom RF modules and integrated microwave assemblies (IMAs), as well as off-the-shelf and customizable components. Leveraging our strong background in the development of RF & microwave components for Tektronix instrumentation, we have the design, assembly and test expertise to develop custom, high-performance RF and microwave solutions to enable next-generation communication systems.
If you’d like additional information, to discuss a project, or to request a quotation, please call or e-mail:
| Phone: | 800-462-9835 |
| Mail: | components@tektronix.com |