Services & Products
Microelectronic Services - Enabling Your Product Development
With over 40 years of experience providing turnkey services for custom microelectronics, Tektronix Component Solutions enables your next-generation systems by providing quality engineering and manufacturing services for high-reliability, high-performance components and technologies.
Tektronix Component Solutions is a US-based, ITAR-registered and accredited Trusted Supplier offering:
ASIC Design Services
Leveraging the same ASIC design team behind the high-performance ASICs driving Tektronix instrumentation, our organization offers custom analog and mixed-signal ASIC design services. With an emphasis on leading edge performance for signal acquisition, generation, conditioning and conversion, our ASIC design team has a disciplined and well-defined approach to delivering custom IC performance and quality. We are a "Ready for IBM Technology" (RFIT) foundry partner, and are validated on IBM's 5HP, 7HP, 7WL, and 8HP SiGe (silicon germanium) processes.
Component Test & Screening
Our DSCC (DLA)-suitable component test labs provide comprehensive test solutions to ensure commercial-off-the-shelf (COTS) parts meet the demanding performance requirements of military, space and commercial aerospace applications. Offering screening services ranging from burn-in and life testing to destructive physical analysis (DPA) and prohibited materials analysis (PMA), our team has the rigorous testing capability to validate or quantify component performance and reliability.
High-Speed Data Converter Modules
Utilizing IC technology originally developed for Tektronix instrumentation, we offer high-performance digitizer and digital-to-analog (DAC) converter modules. Available as reference modules or customizable to meet specific form, fit and function requirements, these modules offer real-time streaming performance with sample rates exceeding 12 GS/s.
IC Packaging
Specializing in high-performance, low-volume custom IC package development, Tektronix Component Solutions can manage the full-slate of packaging requirements - from design to lean manufacturing to test and supply chain management - to deliver fully assembled and tested devices. With experience across a variety of package and interconnect technologies, including flip-chip, ball-grid arrays (BGA), wire bond and multi-chip modules, our organization has the expertise to develop a custom solution to meet our customer's unique packaging requirements.
RF and Microwave Modules
As a turnkey provider of microelectronics services, our capabilities and experience extend to the RF and microwave realm. We provide full custom development of complex modules such as broadband amplifiers, block up-converters and down-converters, and other types of modules and integrated microwave assemblies (IMAs). In addition, we also offer "off-the-shelf" products - including dielectric resonator oscillators (DROs) and switched filter banks (SFBs) - that can be purchased as standard components or customized to meet specific form, fit and function requirements.
If you'd like additional information, or to request a quotation, please call or e-mail:
| Phone: | 800-462-9835 |
| Mail: | components@tektronix.com |