Destructive Physical Analysis (DPA)

DPA is the disassembly, testing and inspection of a semiconductor, microcircuit or passive device to determine how well it conforms to its design and process requirements. DPA is often used as a subset of a broader set of test requirements.

DPA testing facilitates the early detection of defective or non-conforming material, which lowers the cost of assembly and re-work, thus reducing field failure rates in mission critical applications. DPA is also used as an aid in the detection of counterfeit devices.

When used as part of a device qualification process, DPA testing can empower our customers to identify and qualify new or alternative devices to ensure the fulfillment of delivery commitments when material shortages or device quality issues arise.

Our breadth of DPA services include:

External Visual Inspection
Lead Fatigue / Terminal Strength
Chemical & Plasma Etching
Cross-section Analysis
Internal Visual Inspection
Residual Gas Analysis (RGA)
Constructional Analysis
Digital Microscopy
Physical Dimension Analysis
Bond Strength Testing
Scanning Electron Microscopy (SEM)
Electron Dispersive X-ray Spectroscopy (EDS)

Industry Standards Compliance:

MIL STD-1580B
MIL STD-883F (Microcircuits & hybrids)
MIL STD-750D (Semiconductors)
SSQ-25000 and SSQ-25001 (Space Station Program)

If you'd like additional information or to request a quotation, please call, e-mail or download:

Phone:	800-775-2550
Mail:	components@tektronix.com
Line Card:	Component Test (464 kB)