IC Package & Hybrid Interconnect Technologies
ENABLING PERFORMANCE, RELIABILITY AND QUALITY IN COMPLEX MICROELECTRONICS
Selecting the optimal interconnect technology is a key factor in maximizing the performance of your device, since interconnect method can directly impact package and hybrid characteristics such as signal speed, signal integrity, and cost, size, weight and power (C-SWaP).
Tektronix Component Solutions has extensive experience with a variety of interconnect technologies and can help select, design and assemble the appropriate interconnect for your device. From wire-bond and ball-grid-array (BGA) flip chip devices, to high-density wire-bonding and optical interconnects Tektronix Component Solutions is the partner you can rely on to optimize the performance of your IC package and/or hybrid. In addition, Tektronix Component Solutions can support a variety of die attach requirements - utilizing solder or epoxy bonding methodologies for basic requirements and eutetic die attach techniques for hermetic packaging.
| Flip-Chip | Wire-Bond | Optical |
|---|---|---|
 |
 |
 |
Flip-Chip
Flip-chip has emerged as a packaging technology of choice for managing C-SWaP considerations. By using the entire surface of the die for establishing interconnect, package size can be reduced and interconnect density increased. Additionally, directly connecting the die to the substrate or board shortens the signal path length, thereby reducing impedance and improving overall electrical performance.
As a high-performance IC packaging and hybrid provider, Tektronix Component Solution has extensive experience in flip-chip interconnect technology. We offer complete turn-key development services for flip-chip parts and can meet the following specifications for flip-chip ball-grid-array (FCBGA) devices:
| Process Capabilities | Units | Routine | Special |
|---|---|---|---|
BGA Ball Chemistry |
|
63SnPb or SAC305 |
|
BGA Ball Diameter |
mils |
18 / 24 / 30 |
<18 |
BGA Pitch (min) |
mm |
1 / 1.27 |
0.8 |
BGA Pad Definition |
|
Soldermask-defined |
Metal-defined |
Substrate Pad Diameter |
|
0.8 x Solder Ball Diameter |
0.7 x Solder Ball Diameter |
Package Size |
mm |
27 x 27 |
40 x 40 |
Number of C4 I/Os (max) |
|
< 500 |
< 1700 |
Die Size (max) |
mm |
8 |
12 |
Underfill Keepout Around Die (min) |
mm |
2 |
< 2 |
In addition, we have experience with high-lead C4 balls, eutectic C4 balls and lead-free C4 balls, plus a wide variety of organic and ceramic substrate materials, making us an ideal partner for developing high-performance flip-chip devices.
Wire-Bond
Wire-bonding has proven to be a dominant interconnect technology due to its versatility, performance and reliability. Recent advances in ultra-fine-pitch wire-bonding have allowed for package-size reduction while providing higher interconnect densities. Additionally, wire-bonding can be accomplished on a variety of substrates, ranging from PCBs to multi-layer and thick-film ceramics and flexible circuits, offering a dynamic interconnect solution.
Advanced wire-bonding is a core competency at Tektronix Component Solutions. We utilize both gold and aluminum wire-bond materials and can support multi-row and high-density interconnect requirements. Additionally, we have well-established capabilities in both primary bonding methodologies:
Ball-stitch bonding (thermosonic and thermocompression):
| Process Capabilities | Units | Routine | Special |
|---|---|---|---|
Wire Diameter |
mils |
0.8, 1, 1.2 |
0.7 |
IC Bond Pad Dimensions |
µm |
65 x 65 |
50 x 50 |
IC Bond Pad Pitch - Inline (min) |
µm |
80 |
75 |
IC Bond Pad Pitch - Staggered (min) |
µm |
150 |
125 |
Wirebond Length (min) |
mm |
1 |
0.4 |
Wirebond Length (max) |
mm |
3 |
4 |
Wedge bonding (thermosonic and ultrasonic):
| Process Capabilities | Units | Routine | Special |
|---|---|---|---|
Wire Diameter |
mils |
0.8, 1 |
0.7 |
Ribbon Width |
mils |
2-3 |
8 |
Bond Finger - Au Plating Thickness(min) |
µin |
35 |
75 |
IC Bond Pad Dimensions (min) |
µm |
65 x 65 |
50 x 50 |
IC Bond Pad Pitch - Inline (min) |
µm |
100 |
80 |
IC Bond Pad Pitch - Staggered (min) |
µm |
150 |
125 |
Wirebond Length (min) |
mm |
1 |
0.4 |
Wirebond Length (max) |
mm |
3.75 |
5 |
Optical
In addition to traditional IC packaging and hybrid interconnect methods, Tektronix Component Solutions also has advanced capabilities in optical interconnect technologies. Our capabilities include but are not limited to:
- Fiber tip polishing and lensing
- Active optical alignment for multi-mode fiber products
- Single or multi-channel devices
- Fiber positioning and attachment
- Hermetic fiber sealing
- Micro-optic lens design
- Opto-mechanical package design
- VCSEL characterization for temperature stability
- Parallel Bit Error Rate Testing (BERT)
- Custom optical test fixture design and test station development
- Optical component selection
If you'd like additional information, or to discuss a potential project, please call, e-mail or download:
| Phone: | 800-462-9835 |
| Mail: | components@tektronix.com |
| Line Card: | IC Packaging (520 kB)  |