IC Package & Hybrid Technologies
ENABLING PERFORMANCE, RELIABILITY AND QUALITY IN COMPLEX MICROELECTRONICS
Tektronix Component Solutions excels in designing some of the highest performance custom packages and hybrids in the world. Our advanced package and hybrid development services optimize critical performance parameters such as signal speed and integrity, while controlling other parameters such as temperature. The key design challenges are to select the appropriate packaging technology and manage the resulting design tradeoffs. Our ability to draw from a broad base of packaging and hybrid technologies, including ball-grid-arrays, leadless chip carriers/quad-flat-no-leads, chip-on-board & chip-on-flex, multi-chip-modules, system-in-package, and mixed-technology devices, all described in detail below, is a key factor in optimizing your components.
| Ball-Grid-Array (BGA) | Leadless-Chip-Carrier (LCC) / Quad-Flat-No-Lead (QFN) | Chip-on-Board / Chip-on-Flex | Multi-Chip-Module (MCM) & System-in-Package (SiP) | Mixed-Technology |
|---|---|---|---|---|
 |
 |
 |
 |
 |
Ball-Grid-Array (BGA)
Offering short signal paths, controlled line impedance, and a solution for integrated circuits (ICs) with high-interconnect density, ball-grid-array packages provide a means of reducing component size while supporting high-density interconnect requirements.
Utilizing circuit simulation, electromagnetic simulators and other advanced design tools, Tektronix Component Solutions can develop custom wire-bond and flip-chip ball-grid-arrays, including cavity-down, dam-and-fill and glob encapsulation solutions, to meet your application requirements.
| Process Capabilities | Units | Routine | Special |
|---|---|---|---|
BGA Ball Chemistry |
|
63SnPb or SAC305 |
|
BGA Ball Diameter |
mils |
18 / 24 / 30 |
<18 |
BGA Pitch (min) |
mm |
1 / 1.27 |
0.8 |
BGA pad definition |
|
Soldermask-defined |
Metal-defined |
Substrate Pad Diameter |
|
0.8 x Solder Ball Diameter |
0.7 x Solder Ball Diameter |
Package Size |
mm |
27 x 27 |
40 x 40 |
Number of C4 I/Os (max) |
|
< 500 |
< 1700 |
Die Size (max) |
mm |
8 |
12 |
Underfill Keepout Around Die (min) |
mm |
2 |
< 2 |
We also offer performance BGA platforms designed for applications requiring a high-speed and high-reliability packaging solution. These ball-grid-array platforms support bandwidths up to 15 and 32 GHz and high pin-count ASICs (> 150 pins).
15 and 32 GHz BGA Specifications:
- Organic (PTFE) or ceramic (LTCC) substrates for 32 GHz bandwidth
- RF connectors can be integrated for applications requiring > 35 GHz bandwidth
- RL ≤ - 10 dB
- IL ≥ - 2 dB
- High-density BT for 15 GHz bandwidth
- RL ≤- 15 dB
- IL ≥- 2 dB
- Thermal Resistance: 0.3 - 0.5 °C/W
- MSL4 and RoHS L6 compliant
Leadless Chip Carrier (LCC)/Quad-Flat-No-Lead (QFN)
Leadless chip carriers provide a lower-cost, Surface Mount Technology (SMT) compatible solution. Well-suited for devices with low wire-bond/pin count configurations, LCC packages have proven to be a viable solution for a variety of applications.
To meet the broadband performance requirements of telecommunications systems, military and aerospace applications, and terrestrial communications, Tektronix Component Solutions offers a 40 GHz Leadless Chip Carrier packaging platform. The LCC platform provides a means to achieve next-generation performance in product development while managing aggressive design goals to reduce size, weight and power (SWaP).
40 GHz LCC Specifications:
- Wire-bond interconnect for low pin-count ASICs (≤ 40 pins)
- High-Temperature Co-fired Ceramic (HTCC) Package
- DC to 40 GHz bandwidth
- RL ≤ - 10 dB
- IL ≥ - 1.5 dB
- Solder-sealable for MIL-STD-883 compliance
Chip-on-Board (COB) & Chip-on-Flex (COF)
A chip-on-board packaging solution shortens the signal path down to the board-level, improving signal integrity and electrical performance. A chip-on-flex solution offers similar performance benefits, except that the package can also bend, making it a good solution for devices with tight spacing requirements.
Tektronix Component Solutions has extensive experience developing both chip-on-board and chip-on-flex IC packages and hybrids. With advanced flip-chip and wire-bond capabilities, and a variety of encapsulation options - including low cost glob top - we can develop a custom solution to meet your component needs.
Multi-Chip-Module (MCM) & System-in-Package (SiP)
Incorporating multiple integrated circuits (ICs) into a single device, multi-chip-modules offer benefits in device size and performance. By shortening the signal-path between ICs, and using a common high-performance substrate material, multi-chip-modules can improve device operation while managing size and weight constraints.
A system-in-package solution offers the capabilities of a complete system in one device. By reducing the footprint of the package on the final board assembly, a system-in-package provides expanded functionality in a smaller form factor.
As a high-performance packaging and hybrid provider, Tektronix Component Solutions has designed, assembled and tested a variety of multi-chip-modules and system-in- package devices. With proven experience developing custom solutions for some of Tektronix' highest-speed assemblies, our multi-chip-module and system-in-package solutions can help product developers achieve next-generation performance levels.
Mixed Technology Devices
In many cases, achieving the appropriate balance of designing for manufacturability and performance requires the "mixing" of various assembly techniques and technologies. Our custom IC package and hybrid development team can select the appropriate combination of active and passive SMT components, substrate, and interconnect technology - in addition to your ICs - to develop a successful packaging solution.
SMT Process Capabilities:
| Process Capabilities | Units | Routine | Special |
|---|---|---|---|
SMT Component Size (min) |
|
0201 |
0201 |
SMT: Adjacent Component Pad Spacing, < 0603 (min) |
mils |
15 |
10 |
SMT: Adjacent Component Pad Spacing, > 0603 (min) |
mils |
20 |
15 |
If you'd like additional information, or to discuss a potential project, please call, e-mail or download:
| Phone: | 800-462-9835 |
| Mail: | components@tektronix.com |
| Line Card: | IC Packaging (520 kB)  |